Capabilities
• Layer Count: 1 to 20 Layers
• Min. Trace: 4 mils
• Min. Space: 4 mils
• Blind Vias
• Laser Drill
• Controlled Impedence
• TDR Testing
• Net List Test
• Hard Gold Finger
• Soft Bondable Gold
• Immersion Gold
• Entek
• HAL "ROHS" Lead Free
• Immersion Tin
• Immersion Silver
• Metal Backed Boards
• Plated Radii (Castellation) Materials
• FR4 140° Tq, 170° Tg, ROHS
• Teflon / Duroid (Rogers, Taconic, Arlon, Neltec,
Polyflon)
• Flex
• G-Tek
• Polyimide
• Hybrid Board Teflon / FR4
• Metal Backed Boards
• Cµ Weight 1/4 to 5 oz.
Tolerance
• Routing: +/- 0.125mm Std. +/- 0.10mm on Special
Request *
• Hole Tolerance: +/- 0.075mm, +/- 0.025mm on
Special Request*
• Min. Slot Width : 0.80mm
• Drill Positioning +/- 0.05mm
• Pad over FHS: 0.127mm
• Clearance Pad over FHS: 0.50mm
• Soldermak clearance over PAD size: 0.127mm
• Etch Tolerance: +/- 5%
Lead-Time
• 2 - 4 layers: 1~2 weeks Std, 5 days on Special
Request*
• 6 - 8 layers: 2~3 weeks Std, 7 days on Special
Request*
• 10 - 12 layers: 3~4 weeks Std, 10 days on Special
Request*
• 12 Above: TBD upon request.
* Specification are subject to factory scheduling upon
received the order and will be reviewed for manufacturability.
* All designs are subject to manufacturability review. |
