Dysteq : Manufacturing/ Testing equipment, Electronics & Automation Supplies, Substrate Cleaner & Accessories

ELECTRONICS COMPONENTS SUPPLIES

BALL GRID ARRAY CONNECTOR SERIES

		PIN GRID ARRAY SOCKET • Contact Material: Brass. • Insulator Material: Black Polyester UL94V-0. • Operating Temperature:-55oC to +105oC. • Soldering Temperature: +260oC, 10s Max. • Pitch: 2.54mm x 2.54mm, 2.54mm x 1.27mm.

		MICRO PIN GRID ARRAY SOCKET • Contact Material: Brass. • Insulator Material: Black Polyester UL94V-0. • Operating Temperature:-55oC to +105oC. • Soldering Temperature: +260oC, 10s Max. • Pitch: 12.7mm x 12.7mm.

		SOLDER TAILS PIN ARRAY SOCKET • Contact Material: Brass. • Insulator Material: Black Polyester UL94V-0. • Operating Temperature:-55oC to +105oC. • Soldering Temperature: +260oC, 10s Max. • Pitch: 2.54mm x 2.54mm, 2.54mm x 1.27mm.